“Ambient Temperature” is a widely used thermal performance indication by most PC manufacturers. However, there is no standard for testing method of this specification.
CONTEC employs a stringent testing methods anticipating the use of its products in the real-world or even harsher environment, testing PCs under heavy load in an unventilated or virtually no air-flow thermal chamber.
The opening of thermal test chamber is closed with an acrylic board to prevent air-flow from outside, assuming a PC installed within a very narrow gap where little ventilation is expected. The new CONTEC BX series embedded computers are tested under heavy load in this thermal chamber and prove fully functional at 0– 50°C ambient temperature range. This figures are equivalent to 0 – 60°C in a ventilated thermal test chamber, and 0 – 65°C in open air test environment.
It is particularly worth noting that CONTEC BX series embedded PCs are designed fanless, yet clear this rigorous testing methods.