Our Commitment to Quality

Why Fanless? – In Pursuit of “Real World” Reliability

CONTEC is a company of designers and engineers dedicated to delivering best-value products and solutions based on innovative applications of the latest technology.
CONTEC's comprehensive quality assurance framework defines specific quality requirements to deliver unsurpassable reliability without sacrificing performance and usability. For example, our products must pass more than 500 check points, proven and accumulated through over 30 years product development experience, before they are shipped to our customers.
At CONTEC, “quality” is the synonym for “reliability”, meaning much more than catalog specs and performance figures, as we know, for most of our industrial customers, reliability is the most important single factor in the course of their selection.
The following is a couple of episodes hidden behind our product development scenes of CONTEC's well-known Box PCs for embedded systems.

Achieving Guaranteed Operating Temperature Range 0 – 50°C with Fanless Design

Pitfall of “Operating Temperature” representation

“Ambient Temperature” is a widely used thermal performance indication by most PC manufacturers. However, there is no standard for testing method of this specification.
CONTEC employs a stringent testing methods anticipating the use of its products in the real-world or even harsher environment, testing PCs under heavy load in an unventilated or virtually no air-flow thermal chamber.

The opening of thermal test chamber is closed with an acrylic board to prevent air-flow from outside, assuming a PC installed within a very narrow gap where little ventilation is expected. The new CONTEC BX series embedded computers are tested under heavy load in this thermal chamber and prove fully functional at 0– 50°C ambient temperature range. This figures are equivalent to 0 – 60°C in a ventilated thermal test chamber, and 0 – 65°C in open air test environment.
It is particularly worth noting that CONTEC BX series embedded PCs are designed fanless, yet clear this rigorous testing methods.

Why Fanless? – Motherboard and Enclosure Optimized for Fanless Design

Our customers are industrial users, and we know that our users' dream machines are maintenance-free PCs. That is why CONTEC engineers were sticking to fanless design – industrial computers with No Moving Parts.
However, designing true industrial grade fanless PC was not an easy task. Using larger heat-sink and making more air intakes simply would not work.

To optimize BX series embedded PC for fanless design, all design factors has been re-examined from scratch, from motherboard and enclosure design, parts layout, the shape of heat-sinks and to position of slits. CONTEC engineers employed a variety of testing and verification methods, including scientific analysis by using a thermofluid simulator, heat distribution analysis by using a thermo-camera and actual measurement by using working prototypes.

This is just a part of our commitment, making our products deserve the name “CONTEC Quality.”